Chip accommodation tray
作者： Kazuma Sekiya
DOI:
关键词:
摘要: A chip accommodation tray for accommodating a plurality of chips includes holding sheet the on face side thereof, having tack force and first pores formed therethrough, frame including bottom wall supporting reverse sheet, second walls erected from in surrounding relation to sheet. Air is supplied below through ejected toward lower surfaces held thereby peeling off
lens.org 参考文章(27)
Akira Mizoi, Method for manufacturing a holding tray for chip components ,(1999)
Rachel S. Sidorovsky, Adrian Murphy, Bidyut Sen, Michael J. Steidl, Jon M. Long, Semiconductor device package and method of making such a package ,(1990)
Satoki Sakai, Jiro Todoroki, Chip element holder and method of handling chip elements ,(2002)
Nobuyuki Kasama, Wafer container with cushion sheets ,(2007)
Jian Ping Jin, Leng Kheam Lee, Multifunction wafer and film frame handling system ,(2013)
Dana C Bookbinder, Charlene M Smith, Lisa A Moore, Glenn E Kohnke, Kenneth E Hrdina, Susan L Schiefelbein, Ulrich Neukirch, Synthetic silica material with low fluence-dependent-transmission and method of making the same ,(2006)
Maria G. Guardado, Mohammad Khan, Raj N. Master, Loo L. Teoh, Ahmad Juwanda, Boat for organic and ceramic flip chip package assembly ,(2000)
Akihiko Nakamura, Method and apparatus for releasing support plate and wafer chips from each other ,(2007)
Robert D Mcnutt, Edward M Davis, Arthur H Mones, Connections for microminiature functional components ,(1966)