Laser machining of a workpiece
作者： Bernold Richerzhagen , Akos Spiegel
DOI:
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摘要: The invention relates to a device (1) for cutting wafers (2) into number of chips with laser beam (6) injected liquid jet (7). A thin flowing layer (9) having blasting effect is produced on the surface (5) wafer (2). This makes it possible prevent projections resulting during from depositing once again wafer. result very high cleanness after process. produced, in particular, so that thinner machining area (10) around point (8) than outside (10). ensures sufficiently (14) at enough energy removing material applied surface, and thick (15) no dries out.
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