Method and apparatus for cutting a semiconductor wafer
作者： Mitsutoshi Oaza Kurita Higashi , Hideaki Oaza Kurita Sakaguchi
DOI:
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摘要: A method for cutting a semiconductor wafer is provided. mount tape adhered to back surface of the wafer. The comprises resin base and mesh-like member made material harder than that embedded in base. beam-like liquid jet ejected toward front and, simultaneously, laser beam transmitted axially through said jet, so cut into individual pieces, by beam, together with tape, while not cut, but remains its connected state.
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