Method of wafer laser processing using a gas permeable protective tape

摘要: A laser processing method for forming a deteriorated layer, which has been once molten and then re-solidified, in the inside of wafer by applying pulse beam capable passing through to along dividing line formed on wafer, comprising: protective tape affixing step having gas permeability one side wafer; holding affixed thereto chuck table machine such manner that surface onto comes into contact with table; application from other held its focusing point set position near form layer exposed wafer.