Wafer Dicing from Wafer Backside and Front Side

摘要: Approaches for backside laser scribe plus front side and plasma etch dicing of a wafer or substrate are described. For example, method semiconductor having plurality integrated circuits on thereof metallization involves patterning the with first scribing process to provide lines backside. The also forming mask side. patterning, from side, second patterned exposing regions between circuits, wherein is aligned lines. etching through singulate circuits.