Laser beam machining method
作者： Toshimitsu Wakuda , Kenshi Fukumitsu , Fumitsugu Fukuyo , Naoki Uchiyama , Kenichi Muramatsu
DOI:
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摘要: The invention provides a laser beam machining method characterized by comprising the steps of mounting protective tape (25) on surface (3) wafer (1a), radiating light (L) using back (21) (1a) as incidence plane with an optical converging point (P) positioned in substrate (15) to thereby form melt processing region (13) for multiphoton absorption, forming, means (13), cutting start (8) side within predetermined distance from along line (5) expand (23) and stretching separate plurality chip-like portions (24) each other that are formed being cut used starting point.
google.co.uk 参考文章(224)
Takeharu Yamada, Thick film resistor type printed circuit board ,(1989)
Igor Troitski, Method and laser system for creation of laser-induced damages to produce high quality images ,(2000)
Takashi Yumura, Miki Kurosawa, Tetsu Yamamoto, Masayuki Sugahara, Kiyoshi Funai, Shuji Ogawa, Laser machining apparatus and method ,(1993)
William Edmund Bowen, Method of forming a line of weakness in a multilayer laminate ,(1973)
Hiroshi Okumura, Laser irradiation process ,(1999)
Yefim Bukhman, Distributed polishing head ,(1991)
Shoichi Uchiyama, Ryuji Sugiura, Ryo Kawashima, Semiconductor Chip Manufacturing Method, Semiconductor Chip, Semiconductor Thin Film Chip, Electron Tube and Photo-Detecting Device ,(2004)
Timothy L. Kelly, Amin H. Hashemi, Process for determining the quality of temper of a glass sheet using a laser beam ,(1992)
Richard M. Osgood, Miguel Levy, Antonije M. Radojevic, Method for fabricating ultra thin single-crystal metal oxide wave retarder plates and waveguide polarization mode converter using the same ,(2001)