Study on the Influence of Variation of Contact Arc Zone on the Single-Pass Sawing of Sapphire Wafer

摘要: Single-pass sawing (SPS), a significant cutting process widely used in the manufacturing of optical components optoelectronic fields, which can greatly improve quality products by reducing proportion edge chipping. In this paper, mechanism SPS was introduced novel approach deep analysis variation contact arc zone. Setting sapphire wafers as workpiece, study performed comparative experiments three specific zones, would further make thorough inquiry on related machining mechanism. The difficulty degree and topography surface during were also analyzed. reflected force ratio, surfaces compared SEM Digital Microscope. results indicate that lower is, easier it be machined SPS. And best appears Arc 2 (arc angle = 20°), set an excellent reference for other materials single-pass is derived basis traditional model, will serve useful references to both industrial academia.