Investigation of chipping and wear of silicon wafer dicing
作者： Jau-Wen Lin , Ming-Hon Cheng
DOI: 10.1016/J.JMAPRO.2014.04.002
关键词: Wafer dicing 、 Blade (archaeology) 、 Diamond 、 Composite material 、 Transient (oscillation) 、 Wafer 、 Rotational speed 、 Forensic engineering 、 Surface finish 、 Surface roughness 、 Materials science
摘要: Abstract Wafer dicing chipping and blade wear processes in transient steady stages were investigated. Dicing blades with two different diamond grit sizes used to cut wafers. In the cutting experiments, wafers for a given type of wafer, cooling water temperature, feed speed, rotational speed fixed. The size, surface area roughness wafer measured at distances 50, 150, 300, 975, 1350, 1900 m, respectively. Cutting debris 300 m 1900 m was collected analyzed. correlation between properties size Based on this experimental system, attention is pay examine stage stage. stage, increases rapidly. This will rapidly increase size. decreases slowly decreasing surface. concludes that condition an important factor affects Moreover, grits are salient or less bonded detach leave caves which heights become even accordingly.
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