Semiconductor substrate cleaning method

作者: Hisashi Okuchi , Minato Inukai , Yasuhito Yoshimizu , Hiroshi Tomita , Hidekazu Hayashi

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摘要: In one embodiment, a semiconductor substrate cleaning method is disclosed. The can clean by using chemical of 80° C. or above. rinse the pure water 40° above after substrate. then 30° below. addition, dry

参考文章(3)
Hisashi Muraoka, Asuka Sato, Mitsuru Endo, Rieko Muraoka, Method and apparatus for removing organic films ,(2003)
Minako Inukai, Kaori Umezawa, Yasuhito Yoshimizu, Hiroshi Tomita, Linan Ji, Cleaning apparatus for semiconductor wafer and cleaning method for semiconductor wafer ,(2009)
Yumiko Abe, Yuji Yamada, Hiroshi Tomita, Hiroaki Yamada, Norio Ishikawa, Semiconductor substrate cleaning liquid and semiconductor substrate cleaning process ,(2007)