Process and apparatus for treating surfaces of wafer-shaped articles
作者： Anders Joel Bjoerk , Philipp Engesser , David Henriks
DOI:
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摘要: An apparatus and method for processing wafer-shaped articles utilizes at least first second liquid-dispensing nozzles, wherein a nozzle is positioned closer to an axis of rotation than the nozzle. A liquid supply system supplies heated process nozzles such that dispensed from has temperature differs by amount within predetermined range
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