Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface.

摘要: Organic-inorganic material hybridization at the solid-state level is indispensable for integration of IoT applications, but still remains a challenging issue. Existing bonding strategies in field electronic packaging tend to employ vacuum or ultrahigh temperature; however, these can cause process complications and deterioration. Here we report an easy-to-tune method achieve hybrid under ambient atmosphere. Vacuum-ultraviolet (VUV)-induced reorganization with ethanol was used develop hydroxyl-carrying alkyl chains through coordinatively-bonded carboxylate onto aluminum, whereas numerous alkyls were created on polyimide. The triggering dehydration hydroxyls by merely heating 150 °C few minutes produced robust organic-inorganic reticulated complexes within aluminum/polyimide interface. as-bonded interface possessed superior fracture energy (2.40 ± 0.36) × 103 (J/m2) compared aluminum polyimide matrices themselves, which mainly attributed crack deflection due nano-grains inorganic-organic complexes. interfacial adhesion successfully kept after humidity test, contributed those anti-hydrolytic carboxylates. To best our knowledge, first time achieved using ethanol-assisted VUV (E-VUV) process, strategy should be applicable diversity plastics metals native oxides.