Monte Carlo Simulation of the Electrodeposition of Copper I. Additive-Free Acidic Sulfate Solution
作者： Timothy J. Pricer , Mark J. Kushner , Richard C. Alkire
DOI: 10.1149/1.1488648
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摘要: Simulation of copper electrodeposition on an initially flat surface by a classic two-step electron transfer sequence accompanied diffusion was carried out three-dimensional (3-D) kinetic Monte Carlo model linked to 1-D (continuum) finite difference model. The evolution deposit roughness simulated numerically and compared, through use scaling parameters with experimental data obtained atomic force microscopy from deposits formed under constant potential in aqueous solutions 0.5 M Cu 2 SO 4 1.0 H . used carry parametric investigations the effect adsorption, diffusion, lattice incorporation, all which were found exert influence roughness.
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