Thermal fatigue properties of lead-free solders on Cu and NiP under bump metallurgies
作者： C. Zhang , Jong-Kai Lin , Li Li
关键词:
摘要: … This paper focuses on the thermal fatigue properties of such solder bumps and two under … deformation before fatigue cracks propagated through the bumps during thermal cycling. …
sci-hub.se 参考文章(5)
S. Suresh, Fatigue of materials ,(1991)
Treliant Fang, Li Li, Conductive paste and semiconductor component having conductive bumps made from the conductive paste ,(2002)
Li Li, Yang Rao, Jong-Kai Lin, Pb-free solder paste reflow window study for flip chip wafer bumping international symposium on advanced packaging materials processes properties and interfaces. pp. 112- 118 ,(2001) , 10.1109/ISAOM.2001.916559
Jong-Kai Lin, A. De Silva, D. Frear, Yifan Guo, Jin-Wook Jang, Li Li, D. Mitchell, B. Yeung, C. Zhang, Characterization of lead-free solders and under bump metallurgies for flip-chip package electronic components and technology conference. ,vol. 25, pp. 300- 307 ,(2001) , 10.1109/ECTC.2001.927767
Jong-Kai Lin, J. Drye, W. Lytle, T. Scharr, R. Subrahmanyan, R. Sharma, Conductive polymer bump interconnects electronic components and technology conference. pp. 1059- 1068 ,(1996) , 10.1109/ECTC.1996.550813