Conductive polymer bump interconnects

摘要: Conductive polymer bonded flip chip interconnect systems can provide an attractive alternative technology in terms of cost and manufacturability. This work examines the feasibility application such a technology. A mathematical model for stencil printing conductive adhesive paste is developed to demonstrate some factors affecting print quality. Designed experiments used optimize bump dimensional uniformity. The electrical performance interconnects evaluated through both GaAs Si devices. microwave insertion loss (S/sub 21/) coplanar waveguide test vehicle showed rate 0.031 dB/GHz non-underfilled assembly 0.065 those with underfill encapsulation. These S/sub 21/ data are almost identical device same structure Au ball bumped assembly. Additional using CT-2 antenna switch on FR4 board (up 2 GHz frequency) Au-Sn eutectic bumps. Reliability bumps was die substrates. Results no failures temperature cycle, humidity, vibration, mechanical shock tests. There were 8.6% HAST 6% thermal tests conditions stated text.