Flow properties of liquid underfill encapsulations and underfill process considerations

摘要: The underfill encapsulation process and corresponding flow behavior are studied numerically experimentally. A 2-D volume of fluid (VOF) FLUENT model was used to better simulate one-side compared a pre-existing analytical model. For the two-side flow, 3-D based on Hele-Shaw approximation created calculate time. also modified by including body force inclined flow. Experiments were performed verify numerical model, good agreement observed for time distance relationship different processes. at varying temperatures allowed inference encapsulant's strong temperature dependent viscosity an optimal process. Experimental results revealed that dispensing from more than one side chip changed thus We noted addition center bumps increases fill just edge bumps. However, two densities bumps, no significant difference total observed.