Advances in flip-chip underfill flow and cure rates and their enhancement of manufacturing processes and component reliability
作者： Daqing Max Shi , J.W. Carbin
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摘要: This paper focuses on significant advances in flip-chip underfill materials via a thorough characterization of the uncured and cured material properties. These characteristics are then translated into what amounts to substantial gains productivity reliability. A unique method for determining flow rates is presented. The data demonstrate critical relationship between viscosity rate as function time temperature. Material cure temperature also presented using results derived from differential scanning calorimetry or DSC. In addition, dielectric constant dissipation factor during process measured an added, more sensitive gauge degree cure. both measurement tools demonstrates optimum parameters are, so achieve glass transition (Tg, generated DSC). Another thermal mechanical property material, linear coefficient expansion, characterized with thermomechanical analysis TMA. summarized terms its actual impact manufacturing component
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