Experimental and numerical study of underfill encapsulation of flip-chips using conductive epoxy polymer bumps
作者： G. Ni , M.H. Gordon , W.F. Schmidt , A. Muyshondt
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摘要: The flow of underfill encapsulant for epoxy bonded flip-chips is studied numerically and experimentally compared to analytical predictions fully developed 2-D flow. A VOF (volume fluid) FLUENT model was used explore the functional relationships between gap size, encapsulant's viscosity surface tension, rate. computational intensiveness this problem prevented direct comparisons numerical experimental data. However, scaled results indicate that are in general agreement with predictions-the times proportional square distance travelled, inversely height tension. constant proportionality, however, differs by up 60% because (and experimental) not near encapsulant-air interface. Experiments at varying temperatures have allowed inference temperature dependent an optimal process.
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