Externally guided underfill encapsulation and subsequent filler particle migration during electronics packaging
作者： C P Tso , K Sundaravadivelu , L B Zhang
DOI: 10.1088/0960-1317/14/2/007
关键词:
摘要: We present a numerical study of the transient multiphase flow liquid encapsulant in microgap formed between parallel plates with special reference to electronics packaging. The surface tension and polarization forces are assumed drive fluid flow. governing equations solved using volume model within framework finite method order predict free front together time spatial evolution filler particle concentration during underfill process. results found be good agreement available reported experimental data. influence force is reduce fill time, increase length distribute particles larger length. new process has practical implications, such as overcoming partial curing epoxy before complete.
harvard.edu
sci-hub.se 参考文章(21)
Weeratunge Malalasekera, Henk K Versteeg, An introduction to computational fluid dynamics : the finite volume method Published in <b>2007</b> in Harlow England by Pearson Education Ltd. ,(1995)
Y. Guo, G.L. Lehmann, T. Driscoll, E.J. Cotts, A model of the underfill flow process: particle distribution effects electronic components and technology conference. pp. 71- 76 ,(1999) , 10.1109/ECTC.1999.776066
G. Ni, M.H. Gordon, W.F. Schmidt, R.P. Selvam, Flow properties of liquid underfill encapsulations and underfill process considerations electronic components and technology conference. pp. 101- 108 ,(1998) , 10.1109/ECTC.1998.678677
S. Haber, H. Brenner, Lateral migration in sheared suspensions: a case study of the 'diffusion' model International Journal of Multiphase Flow. ,vol. 28, pp. 1687- 1696 ,(2002) , 10.1016/S0301-9322(02)00044-7
K. Zhang, A. Acrivos, Viscous resuspension in fully developed laminar pipe flows International Journal of Multiphase Flow. ,vol. 20, pp. 579- 591 ,(1994) , 10.1016/0301-9322(94)90031-0
David Leighton, Andreas Acrivos, The shear-induced migration of particles in concentrated suspensions Journal of Fluid Mechanics. ,vol. 181, pp. 415- 439 ,(1987) , 10.1017/S0022112087002155
C P Tso, K Sundaravadivelu, Capillary flow between parallel plates in the presence of an electromagnetic field Journal of Physics D: Applied Physics. ,vol. 34, pp. 3522- 3527 ,(2001) , 10.1088/0022-3727/34/24/317
C.W Hirt, B.D Nichols, Volume of fluid (VOF) method for the dynamics of free boundaries Journal of Computational Physics. ,vol. 39, pp. 201- 225 ,(1981) , 10.1016/0021-9991(81)90145-5
E.J. Cotts, T. Driscoll, N.R. Guydosh, G. Lehmann, P. Li, Underflow process for direct-chip-attachment packaging IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. ,vol. 21, pp. 266- 274 ,(1997) , 10.1109/PEP.1997.656500
J. Giesler, G. O'Malley, M. Williams, S. Machuga, Flip chip on board connection technology: process characterization and reliability IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. ,vol. 17, pp. 256- 263 ,(1994) , 10.1109/96.311771