Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications

作者: Hai Dong , Kyoung-Sik Moon , C. P. Wong

DOI: 10.1007/S11664-005-0178-2

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摘要: Molecular dynamics (MD) simulation was conducted to investigate the coalescence of Ag nanoparticles and their deposition on a gold substrate at various temperatures from 400 K 1,000 using embedded atom method (EAM). Density distribution function, x-z plane projection, spreading index, index were analyzed gain more insight into sintering diffusion process. Simulation results showed that Au atoms can diffuse each other significantly temperature reform lattice structure after is cooled back K. data also demonstrated even low K, silver spheres be collapsed deposited substrate. Yet higher helpful in enhancing degree collapsing deposition.

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