Molecular dynamics of a molten Cu droplet spreading on a cold Cu substrate

作者: R. Ge , P.C. Clapp , J.A. Rifkin

DOI: 10.1016/S0039-6028(99)00332-5

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摘要: Spreading of a molten Cu droplet on cold substrate is studied by molecular dynamics simulations. An embebbed atom method (EAM) potential used for both and substrate. At the start, equilibrated at 1500 K placed surface 10 K. The spreading spontaneously occurs under attractive atomic forces between atoms. snapshots solidification processes as well dynamic behavior described dimensionless index are quite analogous to those observed in recently reported experiments. A multiply twinned crystal structure formed when completely solidified. It also shown that contact line atoms quickly solidified trapped but can persist via downward motion unsolidified outside neighbor positions frozen which suggests no-slip boundary condition may apply because simultaneous rapid solidification.

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