Interconnections for High-Frequency Applications
作者： K. Boustedt
DOI: 10.1007/978-1-4615-1389-6_26
关键词:
摘要: The drive towards more and wireless communication for various purposes increases the need electronic packages capable of ever-higher operating frequencies. This chapter gives an overview die package interconnects suitable high-frequency operation, i.e., GHz range. Of particular interest are challenges in moving from traditional interconnect methods to gallium arsenide flip-chip technology.
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