摘要: Conventional microwave design uses thin (4-mil thick) MMIC chips epoxied or soldered down to a metal housing dielectric substrate. Thermocompression wire bonds are used connect the other die circuits. Flip chip technology unthinned (25-mil with bumps on its surface, which, when inverted, directly circuit substrate provide simultaneous attach and interconnection. Figure 1 compares two mounting configurations. The flip process is lower in cost than conventional technique, because it eliminates high low yields of wafer thinning via formation while simultaneously improving visual inspection yield by reducing wear tear frontside caused backside processing. Furthermore, an entire manufacturing (wire bonding) eliminated, capital support costs as well bond losses. has been thoroughly demonstrated commercial automotive industry, which shown that exceeds combined replaces. For devices, provides very inductance interconnection suitable for millimeter wave use power devices. A properly designed custom bump can reduce thermal resistance half face-up mounting. Examples solid 2, together mounted assembly.
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