作者: Metin Karayaka , Huseyin Sehitoglu
DOI: 10.1007/BF02670292
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摘要: Thermomechanical fatigue (TMF) and isothermal of unreinforced SiCp-reinforced aluminum 2xxx-T4 alloy were examined. experiments conducted underT min = 100 °C,T max 300 °C andT 200 conditions, at °C. Based on stress range, substantial improvements in life observed with reinforcement under both thermomechanical loading conditions. strain the TMF lives reinforced material increased out-of-phase (OP) remained unchanged in-phase (IP) loading. A decrease compared to those was 3 × 10−3 s−1 10−5 Crack growth mechanism maps constructed identify crack behavior materials. The OP conditions more favorable transgranular cracking. Mixed (transgranular intergranular) occurred IP experiments. Evidence void formation grain boundaries, deflection due particles, oxide penetration tips is demonstrated using scanning electron microscopy (SEM) Auger spectroscopy analysis.