Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler

摘要: The thermal conductivity of several types a commercial polyimide (specifically, polypyromellitimide: PPMI) film was measured over range temperatures from 4.2 to 300 K using an unguarded steady-state parallel-plate apparatus. Specimens were made by stacking multiple layers together. Conductive grease used between reduce contact resistance. Two specimens two different neat (unadmixed) with thickness 76 micrometers, and three films containing amounts admixed alumina filler having thicknesses 25 micrometers or micrometers. PPMI increases the amount present. same type but is independent thickness, within limits experimental uncertainty. specimen subjected simulated curing process being held at temperature 150 C for ninety minutes indistinguishable that similar, control not such treatment.