Thermal conductivity of polypyromellitimide film with alumina filler particles from 4.2 to 300 K

摘要: Abstract The thermal conductivities of several types a commercial polyimide (namely polypyromellitimide, PPMI) film were measured over range temperatures from 4.2 to 300 K with an unguarded steady state parallel-plate apparatus. Specimens made by stacking multiple layers together. Conductive grease was used between the reduce contact resistance. Two specimens two different neat thickness 76 μm, and three films that contained amounts alumina filler had thicknesses 25 or μm. conductivity PPMI increases amount present. same type but is independent thickness, within limits experimental uncertainty. specimen subjected simulated curing process being held at temperature 150 °C for 90 min indistinguishable similar, control not such treatment.