Interconnection system and method of assembly

摘要: A substrate provided with top and bottom metal clad surfaces is first apertures. The cladding the apertures are protected by a cover film. Insulation covered wires extend across cladding. ends of wire inserted through protrude cover. additional filled wit sealant protruding then trimmed to equal lengths above removed exposin embedded in strengthened sealant. Plating connects cladding, covers provide shielding provides linings which connected layers plating thereover selectively providing electrical pads adhered corresponding linings. In an alternative embodiment prior removal such that on layer. another level plating.