Circuit board with self-supporting connection between sides

作者: Robert Arnold Christiansen , Joel Alan Digirolamo

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摘要: A copper supporting sheet (5) has holes (9) for connecting semiconductor chips (3) to surface mount components (27). laminate of polyimide (7) (13) corresponding the layer with 15 covering those (13). In addition crossing (13), forms conventional circuit patterns. The side having patterns is populated by techniques opposite silicon attached adjacent (9). Wires (17) are ultrasonically bonded and extended inside in (7), where they (15). Crossover connection (17a) achieved using same technique. board densely cost-effective, good heat dissipation characteristics.