Method for connecting leadless chip packages and articles

作者: Philip V. Pesavento

DOI:

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摘要: Leadless chip package (10) is adhesively secured to printed wiring board (14) and electrically connected by metallic conductor ribbon or wire (40, 42, 44...) pads (30, 32, 34, 36) on the (16, 18, 20, 22...) provide secure connection.

参考文章(5)
Harry J. Fardy, Rudolf E. Thun, Joseph A. Ciccio, Integrated circuit device package interconnect means ,(1978)
James E. Elsner, Shawki Ibrahim, Multi-layer ceramic package ,(1980)
Juan Milciunas, Donald F. Gatto, Dual electronic component assembly ,(1982)
Hoelzel Roy John, PRINTED CIRCUIT BOARD ,(1984)