A model for grinding forces prediction in ultrasonic vibration assisted grinding of SiCp/Al composites
作者： Ming Zhou , Wei Zheng
DOI: 10.1007/S00170-016-8726-X
关键词:
摘要: Ultrasonic vibration assisted grinding is an advanced method for machining difficult-to-process materials such as SiCp/Al composites. This paper presents a mechanics model for predicting grinding forces in ultrasonic vibration assisted grinding of SiCp/Al composites. It consists of side grinding force model and end grinding force model. In side grinding force model, the major components are the normal force and tangential force in which the analytical expressions for the chip formation force based on Rayleigh's probability density …
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