METHOD AND DEVICE FOR PREVENTING SUBSTRATE ELECTRIFICATION, AND SUBSTRATE CLEANING DEVICE

摘要: PROBLEM TO BE SOLVED: To provide a technique for effectively preventing particles from sticking to substrate surface by electrification of the substrate, during such chemical process as HF and water-washing process. SOLUTION: Chuck grooves 23a 23b chucking arm 20, which are parts directly contacting water W in wafer-washing holding 14a 14b substrate-holding part 14 cleaning path 2a metal silicon is conductive material, these grounded at an outside device through grounding line wired inside insulation. As result this, static electricity occurring wafer- washing released ground set line, without wafer being electrified, so prevented W, due electricity.