Electro-thermal nested die-attach design

摘要: A design having a semiconductor microchip bonded to circuit board is described. This may include: printed (58); (56) the (58) by means of an adhesive layer placed between bonding surface and desired site on providing for thermal relief as well electrical contact (58), consisting two or more concentric regions that adjoin but do not overlap one another; being center core region (50) thermally electrically conductive material; other perimeter (54) nonconductive material surrounding such region's inner boundary completely bounds (50); outer extends lead (56). Other devices, systems, methods are also disclosed.