Coating method and coater

摘要: PURPOSE: To uniformize the thickness distribution of a coating film and to repidly discharge mists. CONSTITUTION: A wafer 1 is held by spin chuck 7 arranged in treating container 2 rotated, photoresist soln. 18 dripped, 19 formed coater. subhood 21 with height from head opening 11 freely adjustable provided above main hood 8 on upside exhaust gas around wafer. Accordingly, since exhausting power compensated raising subhood, volume exhausted suppressed, vaporization solvent an increase prevented at peripheral part The mist 18a scattered upward suction force hence mists are effectively collected subhead, not returned wafer, entirely discharged outside container.