SUBSTRATE PROCESSING DEVICE
作者： Yoshihara Kosuke , Takayanagi Yasuharu
DOI:
关键词:
摘要: PROBLEM TO BE SOLVED: To provide a substrate processing device achieving uniformity of process film, mist prevention and increase exhaust efficiency factory. SOLUTION: The supplies resist liquid onto the surface wafer rotated by spin chuck 16 from an application nozzle 17 spreads to form film. includes outer cap 62 with wall part 62a surrounding side held chuck, inner 63 disposed under periphery wafer, middle 64 fixed peripheral cap, gap 65 between it edge having plurality air holes 66 communicating upper open/close member 67 shutting off flow passing through in elevating cylinder 68 moving it. When supplying liquid, are closed member. forming opened. COPYRIGHT: (C)2010,JPO&INPIT
lens.org 参考文章(7)
Hiroichi Inada, Kosuke Yoshihara, 孝介 吉原, 博一 稲田, Coat forming device ,(2005)
Satoshi Oka, 賢哉 青木, Masaya Aoki, Solution processing apparatus ,(2001)
Tae-Gyu Kim, Tae-Sang Park, 兌圭 金, 泰相 朴, Apparatus for processing substrate surface ,(2005)
Fukuda Yuji, Inada Hiroichi, Deguchi Masatoshi, COATING TREATING DEVICE AND METHOD THEREFOR ,(2002)
Kobayashi Hiroshi, Matsunaga Sanenobu, ROTARY SUBSTRATE COATER ,(1997)
Kumagai Osahisa, REGIST COATING DEVICE ,(1992)
Yoichiro Tamiya, 正成 原島, Masashige Harashima, 昭司 金井, Shoji Kanai, 慶造 黒岩, Keizo Kuroiwa, 孝 山上, Masayoshi Kanematsu, 雅義 兼松, 信哉 大金, Masahiro Ishiuchi, 洋一郎 田宮, Shinya Okane, Takashi Yamagami, 正宏 石内, Coating method and coater ,(1995)