作者: Hongsik Park , Jeehwan Kim , Byungha Shin , Christos D. Dimitrakopoulos
DOI:
关键词:
摘要: A method for forming nanostructures includes bonding a flexible substrate to crystalline semiconductor layer having two-dimensional material formed on side opposite the substrate. The is stressed in first direction initiate cracks layer. are propagated through and material. stress of released provide parallel structures including