Review of thermal boundary resistance of high-temperature superconductors

摘要: Solid-solid thermal boundary resistance plays an important role in the stability of many electronic circuits, microdevices, and superconducting devices. The (R b ) at any interface causes a temperature discontinuity, which can result heat accumulation on one side raise much above stable region, causing device failure. With advent high-critical-temperature (high-T c superconductors, it is possible to make devices practically achievable temperatures. As current trend goes toward development more high-Tc devices, need for better understanding superconductors becomes mandatory. This paper compiles all theoretical experimental work date onR both thin-film bulk forms, provides critical review cited works. also describes effect state high-T based experiments low-Tc explanation these data existing theory low-T superconductors.