Exploring the activation energy during nanoscale structural evolution in wet etching

作者: M.A. Gosalvez , K. Sato

DOI: 10.1109/MHS.2004.1421289

关键词:

摘要: Extensive numerical simulations of anisotropic etching exact and vicinal Si(111) are performed for the first time using target rate kinetic Monte-Carlo (TR-KMC) algorithm. The results show that removal layers on is largely controlled by step propagation pit nucleation has a vanishingly small role. In turn, flow itself kink and, only to minor extent, nucleation.

参考文章(8)
Jérôme Kasparian, M. Elwenspoek, Philippe Allongue, Digital computation and in situ STM approach of silicon anisotropic etching Surface Science. ,vol. 388, pp. 50- 62 ,(1997) , 10.1016/S0039-6028(97)00356-7
M A Gos lvez, R M Nieminen, Surface morphology during anisotropic wet chemical etching of crystalline silicon New Journal of Physics. ,vol. 5, pp. 100- 100 ,(2003) , 10.1088/1367-2630/5/1/400
M. A Gosálvez, A. S Foster, R. M Nieminen, Multiscale modeling of anisotropic wet chemical etching of crystalline silicon EPL. ,vol. 60, pp. 467- 473 ,(2002) , 10.1209/EPL/I2002-00287-1
M. A. Gosálvez, R. M. Nieminen, Relation between macroscopic and microscopic activation energies in nonequilibrium surface processing. Physical Review E. ,vol. 68, pp. 031604- 031604 ,(2003) , 10.1103/PHYSREVE.68.031604
Nicholas Metropolis, Arianna W. Rosenbluth, Marshall N. Rosenbluth, Augusta H. Teller, Edward Teller, Equation of State Calculations by Fast Computing Machines The Journal of Chemical Physics. ,vol. 21, pp. 1087- 1092 ,(1953) , 10.1063/1.1699114
Andrea C Levi, Miroslav Kotrla, Theory and simulation of crystal growth Journal of Physics: Condensed Matter. ,vol. 9, pp. 299- 344 ,(1997) , 10.1088/0953-8984/9/2/001
A.B. Bortz, M.H. Kalos, J.L. Lebowitz, A new algorithm for Monte Carlo simulation of Ising spin systems Journal of Computational Physics. ,vol. 17, pp. 10- 18 ,(1975) , 10.1016/0021-9991(75)90060-1
M.A Gosálvez, A.S Foster, R.M Nieminen, Atomistic simulations of surface coverage effects in anisotropic wet chemical etching of crystalline silicon Applied Surface Science. ,vol. 202, pp. 160- 182 ,(2002) , 10.1016/S0169-4332(02)00903-0