LED design optimization by means of virtual assembly process based on FEM simulation
作者： S. Watzke , P. Altieri-Weimar
DOI: 10.1109/EUROSIME.2013.6529906
关键词:
摘要: In this study the influence of assembly process steps on reliability behavior Light Emitting Diodes (LED) products is investigated. A virtual developed in Finite Element (FE) model and validated using experimental results deriving from material characterization as well robustness LED products. Focus set delamination failures correlation between failure risk variations process. Additional environmental conditions such temperature moisture concentration are taken into account during The FE gives insights relationship assembled product offers capability design optimization to ensure
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