Magnetic pole fabrication process and device

作者: Boris Kobrin , Edward Ostan

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摘要: A method and apparatus for fabricating an electroplating mask the formation of a miniature magnetic pole tip structure. The incorporates silylation process to silylate photoresist after creating cavity or trench (60) in mask. is performed dry etch photoresist. Alternatively, lithographic patterning trench. As result chemical biasing, vertical side walls (62, 64) layer shift inward narrower resulting structure (65) formed has width less than 0.3 micrometers. This can be used as thin film head ('TFH') data storage device.

参考文章(38)
Monte A. Douglas, Tapered trench process ,(1986)
Yoji Mashiko, Sumio Nomoto, Sotoju Asai, Hirozo Takano, Kazuo Mizuguchi, Haruhiko Abe, Method for forming patterns by plasma etching ,(1980)
Jer-Ming Yang, Bea-Jane Lin Yang, Kaolin Chiong, Formation of etch-resistant resists through preferential permeation ,(1985)
David John Vinton, Joseph Meyer, Method of forming a resist mask resistant to plasma etching ,(1983)
Jeffrey J. Welser, Waldemar W. Kocon, Hussein I. Hanafi, Stuart M. Burns, Silicon sidewall etching ,(1997)
Gary N. Taylor, Thirumalai N. C. Venkatesan, Device lithography by selective ion implantation ,(1981)