Methods for plating write pole shield structures with ultra-thin metal gap seed layers
作者： Xhavin Sinha , Christian Rene Bonhote , Quang Le
DOI:
关键词:
摘要: Methods and structures for electroplating shield perpendicular thin film write poles having ultra non-magnetic top gaps on the order of a few nanometers are disclosed. Ultra thin, conductive seed layers serve dual purpose as both plating layer gap pole. Due to reduced current carrying capacity layers, an additional thick is also employed aid delivering regions near
google.de 参考文章(18)
Robert William Lamberton, William Jude O'Kane, Combined atomic layer deposition and damascene processing for definition of narrow trenches ,(2002)
Joseph T. Lindgren, Stable electroless fine pitch interconnect plating ,(2011)
Eugene P. Marsh, Metal plating using seed film ,(2005)
Stephen Edward Greco, Cyprian Emeka Uzoh, Method to selectively fill recesses with conductive metal ,(1998)
Thomas R. Omstead, Ming Mao, Ajit P. Paranjpe, Sanjay Gopinath, Randhir S. Bubber, Atomic layer deposition for fabricating thin films ,(2001)
Howard Gordon Zolla, Nian-Xiang Sun, Quang Le, Self aligned wrap around shield for perpendicular magnetic recording ,(2005)
Michael Mallary, Kofi Gyasi, Laminated plated pole pieces for thin film magnetic transducers ,(1997)
Michael Mallary, Three-pole magnetic recording head ,(1988)
Mario Napolitano, Method of forming metal connection elements in integrated circuits ,(2002)