Buried Hard Mask for Embedded Semiconductor Device Patterning
作者： Simon S. Chan , Scott A. Bell , Angela Tai Hui
DOI:
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摘要: Methods and apparatus for manufacturing semiconductor devices, such are described. According to various aspects of the disclosure, a device can be manufactured by forming core region periphery device. A first polysilicon then formed over regions mask is on poly silicon layer second disposed that covers mask. layer. After mask, portions layers uncovered either or masks removed.
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