作者: Jae-Ho Min , Myeong-cheol Kim , Young-Ju Park
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摘要: A method of fabricating an integrated circuit device includes forming first and second preliminary mask structures on a hard layer in respective regions the substrate. Spacers are formed opposing sidewalls structures, structure is selectively removed from between spacers region. The etched using as to define pattern including sidewall with void therebetween region An insulation patterned patterns masks trench having greater width than trench, conductive trenches.