Semiconductor Structures and Methods of Manufacturing the Same

作者: Se-Woong Park , Kil-Ho Lee , Ki-Joon Kim

DOI:

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摘要: A semiconductor device and methods of forming a are disclosed. In the methods, layer, such as an insulating interlayer, is formed on substrate. first trench in mask layer trench. The has thickness from bottom surface to top layer. patterned form that at least partially exposes sidewall portion adjacent exposed second smaller than thickness. etched using etching mask. fluid communication with conductive pattern

参考文章(15)
Sergei Postnikov, Thomas Schulz, Feature patterning methods and structures thereof ,(2011)
Kunal Satyabhushan Girotra, Sung-Hoon Yang, Byoung-June Kim, Thin film transistor array panel and method for manufacturing the same ,(2010)
Junichi Koezuka, Jun Koyama, Yuki Imoto, Tetsunori Maruyama, Yuji Asano, Junichiro Sakata, Driver circuit and semiconductor device ,(2009)
Lev Klibanov, Sherri Lynn Griffin, Method of preparing an integrated circuit die for imaging ,(2005)
Il-Goo Kim, Sang-rok Hah, Kyoung-Woo Lee, Sae-il Son, Method of forming metal interconnection layer of semiconductor device ,(2004)