Modification of liquid/solid interface shape in directionally solidifying Al–Cu alloys by a transverse magnetic field
作者： Jiang Wang , Zhongming Ren , Yves Fautrelle , Xi Li , Henri Nguyen-Thi
DOI: 10.1007/S10853-012-6730-6
关键词:
摘要: Al-0.85wt%Cu and Al-2.5wt%Cu alloys were directionally solidified under different transverse magnetic field (TMF) intensities to investigate the influence of TMF on liquid/solid interface shape with respect various length scales appearing (planar, cellular, dendritic interfaces). Results show that planar cellular interfaces tilt one side then level off increasing although appears not behave in this manner. In situ synchrotron X-ray imaging was applied during directional solidification Al-4wt%Cu alloy a 0.08T TMF, revealing leveling initially sloped interface. Solute redistribution, caused by thermoelectric convection (TEMC), responds changes shape. Because typical should be used estimating velocity TEMC for planar, interfaces, maximum ahead is obtained intensities; correspondingly, interface’s degree slop varies TMF.
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