作者: Frode Kløw , Halvard Haug , Sean Erik Foss
DOI: 10.1016/J.EGYPRO.2013.11.084
关键词:
摘要: QSSPC-calibrated photoluminescence imaging (PLI) was used to determine the rear surface recombination velocity Srear,eff of p-type Si FZ wafers after processing large area screen printed Al contacts with varying paste thickness and firing temperatures. The varied by changing snap off in printer, resulting back field (BSF) investigated scanning electron microscopy. BSF thicknesses between 1.4 6.2 μm were found. saturated at high amounts combined temperatures while an increase eutectic layer observed. Several luminescence images taken each sample different reference samples assess stability technique, uncertainties are discussed.