Module for packaging and electrically interconnecting integrated circuit chips on a porous substrate, and method of fabricating same
作者： Harshadrai Vora
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摘要: A module for packaging and electrically interconnecting integrated circuit chips comprises: a porous ceramic substrate which has major surface that is pitted by portion of the pores. Voltage planes ground lie internal to substrate, metal filled via holes feed through substrate. second material fills pores in form pit free surface. This type resists abrasion substantially less than And lines are disposed over circuits.
lens.org 参考文章(12)
Sheldon H. Butt, Casing for an electrical component having improved strength and heat transfer characteristics ,(1982)
Steven Magdo, Guido A. Lemke, Donald R. Barbour, High performance semiconductor package assembly ,(1980)
Sidney M. Leahy, Coated abrasive product containing fused zirconia grains and method for abrading iron ,(1981)
Nobuyuki Ushifusa, Satoru Ogihara, Kosei Nagayama, Multi-layer ceramic wiring circuit board and process for producing the same ,(1984)
William G. Dorfeld, Coating glass-ceramic surfaces ,(1977)
Brian John Mottram, Kenneth James Jury, Method of grinding a surface of a workpiece and a tool for carrying out the method ,(1974)
Samuel M Kaplan, Insulating body for radio apparatus ,(1931)
Wilhelm Boehm, Method of manufacturing porcelain insulators. ,(1913)
Maurice B Shamash, William W Staley, Fred D Walton, Charles I Denton, Microcircuit modular package ,(1970)
Eiichi Tsunashima, Printed circuit board with silver migration prevention ,(1974)