Electronic circuit substrate
作者： Kiyotaka C , Yukihiro C , O Ibiden Co. Ltd. Noda , O Ibiden Co. Ltd. Tsukada
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摘要: An electronic circuit substrate excellent in reliability, which comprises a porous ceramic sintered body with film devices such as conductive circuit, resistor and capacitor directly formed on surface thereof. A resin is filled the pores of body, bottom are fit into recesses close contact therewith wedged state. method producing aforesaid steps forming body. Then, filling so to under wedge
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