Wafer probe head
作者： Gary L. Estabrook , Emmanuel Sang
DOI:
关键词:
摘要: A wafer probe head has a plate-form support member having tip region and mounting region. At least one electrically conductive is carried by the at connector location spaced from region, connected to connector. The also strain gauge for measuring physical distortion of as result being pressed against device under test virtue relative movement between test.
google.co.uk 参考文章(7)
Charles R. Ratliff, Lee R. Reid, Four-quadrant, multiprobe-edge sensor for semiconductor wafer probing ,(1978)
Robert J. Wurscher, Dennis M. Petrich, Earl H. Rideout, Thomas C. Kelly, Transmission line connector and contact set assembly for test site ,(1981)
R. A. Bailey, M. A. Ussery, P. J. Vail, A Neutron Hardness Assurance Screen Based on High-Frequency Probe Measurements IEEE Transactions on Nuclear Science. ,vol. 23, pp. 2020- 2026 ,(1976) , 10.1109/TNS.1976.4328617
A Evans, Fixed point probe card and an assembly and repair fixture therefor ,(1973)
John K. Logan, Microwave probe fixture ,(1984)
Wiesler Mordechai, Goren Avigdor, Automatic probing apparatus ,(1965)
Howard A. Lewis, Charles W. Coberly, High frequency probe ,(1976)