Semiconductor device and method of manufacturing semiconductor device
作者： Satoshi Uno , Hideaki Tsuchiya , Shinji Yokogawa
DOI:
关键词:
摘要: A semiconductor chip SC includes an electrode pad PAD. Cu pillar PIL is formed on the In addition, interconnect substrate INT a connection terminal TER. The TER contains Cu. For example, of Cu, and formed, for in land shape. However, may not be are connected to each other through solder layer SOL. SOL Sn. Ni NIL either or minimum value L thickness equal less than 20 μm.
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