Abnormal residual stress in nanostructured Al thin films grown on Ti/glass substrates
作者： Sanjeev K. Sharma , Deuk Young Kim
DOI: 10.1016/J.CAP.2013.07.022
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摘要: Abstract The residual stress and micro-structural properties of nanostructured Al thin films prepared by electron beam evaporator are studied. were grown on Ti/glass substrates at normal oblique angles inclination. average aspect ratio nanorods produced an angle incidence 85°, increased from 2.2 to 6.0, as the thickness 100 nm 600 nm. column tilt was observed be in close agreement with theoretical value. XRD pattern showed (111) planes oriented parallel substrate surface. crystallite size ∼9 nm for all deposition (OAD). Abnormal stresses determined OAD. nanocrystalline angle, exhibited tensile stress, while, inclination ( α = 65°, 75°), compressive. Residual stress-free nanocolumnar (Al nanorod films) observed, when they 85°.
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