Enhanced wafer cleaning method
作者： Seokmin Yun , Mark Wilcoxson , Larios John De , John M. Boyd
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摘要: A method for removing post-processing residues in a single wafer cleaning system (100-2) is provided, as illustrated Fig. 2D. The initiates with providing first heated fluid to proximity head (106a-3, 106b-3) disposed over substrate (108). Then, meniscus of the generated between surface and an opposing head. linearly moved under
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